Attachment 151755 Details for Bug 216895 – bonding module's modinfo output

bonding module's modinfo output

bond_modinfo (text/plain), 1.32 KB, created by Shyam kumar Iyer on 2007-04-05 13:24:29 UTC

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Creator: Shyam kumar Iyer

Created: 2007-04-05 13:24:29 UTC

Size: 1.32 KB

patch

obsolete

>filename:       /lib/modules/2.6.9-52.EL.gtest.15/kernel/drivers/net/bonding/bonding.ko
>author:         Thomas Davis, tadavis@lbl.gov and many others
>description:    Ethernet Channel Bonding Driver, v2.6.3-rh
>version:        2.6.3-rh 7C5BC881627CF836F4487F6
>license:        GPL
>parm:           igmp_flood:flood IGMP control traffic on active-backup bonding: yes (default) or no
>parm:           arp_validate:validate src/dst of ARP probes: none (default), active, backup or all
>parm:           arp_ip_target:arp targets in n.n.n.n form
>parm:           arp_interval:arp interval in milliseconds
>parm:           xmit_hash_policy:XOR hashing method : 0 for layer 2 (default), 1 for layer 3+4
>parm:           lacp_rate:LACPDU tx rate to request from 802.3ad partner (slow/fast)
>parm:           primary:Primary network device to use
>parm:           mode:Mode of operation : 0 for round robin, 1 for active-backup, 2 for xor
>parm:           use_carrier:Use netif_carrier_ok (vs MII ioctls) in miimon; 0 for off, 1 for on (default)
>parm:           downdelay:Delay before considering link down, in milliseconds
>parm:           updelay:Delay before considering link up, in milliseconds
>parm:           miimon:Link check interval in milliseconds
>parm:           max_bonds:Max number of bonded devices
>depends:        
>vermagic:       2.6.9-52.EL.gtest.15 gcc-3.4

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Attachments on bug 216895: 148312 | 149677 | 151555 | 151687 | 151755 | 151756