Bug 2348156 (CVE-2022-49468)
| Summary: | CVE-2022-49468 kernel: thermal/core: Fix memory leak in __thermal_cooling_device_register() | ||
|---|---|---|---|
| Product: | [Other] Security Response | Reporter: | OSIDB Bzimport <bzimport> |
| Component: | vulnerability | Assignee: | Product Security DevOps Team <prodsec-dev> |
| Status: | NEW --- | QA Contact: | |
| Severity: | medium | Docs Contact: | |
| Priority: | medium | ||
| Version: | unspecified | CC: | dfreiber, drow, jburrell, vkumar |
| Target Milestone: | --- | Keywords: | Security |
| Target Release: | --- | ||
| Hardware: | All | ||
| OS: | Linux | ||
| Whiteboard: | |||
| Fixed In Version: | Doc Type: | If docs needed, set a value | |
| Doc Text: | Story Points: | --- | |
| Clone Of: | Environment: | ||
| Last Closed: | Type: | --- | |
| Regression: | --- | Mount Type: | --- |
| Documentation: | --- | CRM: | |
| Verified Versions: | Category: | --- | |
| oVirt Team: | --- | RHEL 7.3 requirements from Atomic Host: | |
| Cloudforms Team: | --- | Target Upstream Version: | |
| Embargoed: | |||
Upstream advisory: https://lore.kernel.org/linux-cve-announce/2025022602-CVE-2022-49468-fc5a@gregkh/T |
In the Linux kernel, the following vulnerability has been resolved: thermal/core: Fix memory leak in __thermal_cooling_device_register() I got memory leak as follows when doing fault injection test: unreferenced object 0xffff888010080000 (size 264312): comm "182", pid 102533, jiffies 4296434960 (age 10.100s) hex dump (first 32 bytes): 00 00 00 00 ad 4e ad de ff ff ff ff 00 00 00 00 .....N.......... ff ff ff ff ff ff ff ff 40 7f 1f b9 ff ff ff ff ........@....... backtrace: [<0000000038b2f4fc>] kmalloc_order_trace+0x1d/0x110 mm/slab_common.c:969 [<00000000ebcb8da5>] __kmalloc+0x373/0x420 include/linux/slab.h:510 [<0000000084137f13>] thermal_cooling_device_setup_sysfs+0x15d/0x2d0 include/linux/slab.h:586 [<00000000352b8755>] __thermal_cooling_device_register+0x332/0xa60 drivers/thermal/thermal_core.c:927 [<00000000fb9f331b>] devm_thermal_of_cooling_device_register+0x6b/0xf0 drivers/thermal/thermal_core.c:1041 [<000000009b8012d2>] max6650_probe.cold+0x557/0x6aa drivers/hwmon/max6650.c:211 [<00000000da0b7e04>] i2c_device_probe+0x472/0xac0 drivers/i2c/i2c-core-base.c:561 If device_register() fails, thermal_cooling_device_destroy_sysfs() need be called to free the memory allocated in thermal_cooling_device_setup_sysfs().