Red Hat Bugzilla – Bug 1001299
ECC signature not always padded correctly.
Last modified: 2015-02-25 06:16:36 EST
Created attachment 790689 [details]
Fix to padd incoming ECC signatures correctly.
Description of problem:
Now that we can make ECC signatures, this requires often that the signature data has to be padded or truncated correctly based on what is returned by the card and what is required by NSS.
We already have a method to do this but it only handles the truncation case, not the padding case.
Version-Release number of selected component (if applicable):
Latest rhel5 coolkey
Steps to reproduce.
1. Enroll a 384 bit or higher token with rhcs ecc upcoming errata candidate.
2. Run BobR's smartcard test program.
Some of the signatures attempted by the tool will fail.
We want all support signature types to be performed correctly.
Since 5.10 is only accepting blocker bugs at this point(they have already built a release candidate), I am recommending that we defer this fix until 5.11 and we consider fixing this in 5.10.z.
Jack please clone this bug for RHEL6 (target 6.6) and RHEL 7
This request was evaluated by Red Hat Product Management for inclusion
in a Red Hat Enterprise Linux release. Product Management has
requested further review of this request by Red Hat Engineering, for
potential inclusion in a Red Hat Enterprise Linux release for currently
deployed products. This request is not yet committed for inclusion in
*** Bug 1035438 has been marked as a duplicate of this bug. ***
tested on RHEL 7 as well. Padding is working correctly.