Bug 2525472 (CVE-2026-80625)

Summary: CVE-2026-80625 kernel: RDMA/hns: Fix memory leak of bonding resources
Product: [Other] Security Response Reporter: OSIDB Bzimport <bzimport>
Component: vulnerabilityAssignee: Product Security DevOps Team <prodsec-dev>
Status: NEW --- QA Contact:
Severity: medium Docs Contact:
Priority: medium    
Version: unspecifiedCC: rhel-process-autobot, watson-tool-maintainers
Target Milestone: ---Keywords: Security
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Hardware: All   
OS: Linux   
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A flaw was found in the Linux kernel's RDMA/hns component. During concurrent driver removal and reset operations, bonding resources are incorrectly released and then re-allocated, leading to a memory leak. This memory leak can potentially cause a kernel panic, resulting in a Denial of Service (DoS) for the affected system.
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Description OSIDB Bzimport 2026-08-28 07:46:43 UTC
In the Linux kernel, the following vulnerability has been resolved:

RDMA/hns: Fix memory leak of bonding resources

In a corner case of concurrent driver removal and driver reset,
bonding resource is first released in hns_roce_hw_v2_exit() during
driver removal, and then is allocated again in hns_roce_register_device()
during driver reset. This leads to memory leak because the release
timing has already passed. This may also lead to a kernel panic
as below because of the leaked notifier callback:

Call trace:
  0xffffa20fccc04978 (P)
  raw_notifier_call_chain+0x20/0x38
  call_netdevice_notifiers_info+0x60/0xb8
  netdev_lower_state_changed+0x4c/0xb8

As Sashiko suggested, the teardown order of bonding resources should
be inverted to make sure the resources are released when the driver
is removed.