Bug 2525472 (CVE-2026-80625) - CVE-2026-80625 kernel: RDMA/hns: Fix memory leak of bonding resources
Summary: CVE-2026-80625 kernel: RDMA/hns: Fix memory leak of bonding resources
Keywords:
Status: NEW
Alias: CVE-2026-80625
Product: Security Response
Classification: Other
Component: vulnerability
Version: unspecified
Hardware: All
OS: Linux
medium
medium
Target Milestone: ---
Assignee: Product Security DevOps Team
QA Contact:
URL:
Whiteboard:
Depends On:
Blocks:
TreeView+ depends on / blocked
 
Reported: 2026-08-28 07:46 UTC by OSIDB Bzimport
Modified: 2026-09-01 07:42 UTC (History)
2 users (show)

Fixed In Version:
Clone Of:
Environment:
Last Closed:
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Description OSIDB Bzimport 2026-08-28 07:46:43 UTC
In the Linux kernel, the following vulnerability has been resolved:

RDMA/hns: Fix memory leak of bonding resources

In a corner case of concurrent driver removal and driver reset,
bonding resource is first released in hns_roce_hw_v2_exit() during
driver removal, and then is allocated again in hns_roce_register_device()
during driver reset. This leads to memory leak because the release
timing has already passed. This may also lead to a kernel panic
as below because of the leaked notifier callback:

Call trace:
  0xffffa20fccc04978 (P)
  raw_notifier_call_chain+0x20/0x38
  call_netdevice_notifiers_info+0x60/0xb8
  netdev_lower_state_changed+0x4c/0xb8

As Sashiko suggested, the teardown order of bonding resources should
be inverted to make sure the resources are released when the driver
is removed.


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