Bug 978220

Summary:	[Docs] [Admin]: Improve bonding logic
Product:	Red Hat Enterprise Virtualization Manager	Reporter:	Andrew Burden <aburden>
Component:	Documentation	Assignee:	Tim Hildred <thildred>
Status:	CLOSED CURRENTRELEASE	QA Contact:	ecs-bugs
Severity:	medium	Docs Contact:
Priority:	unspecified
Version:	3.1.1	CC:	aburden, acathrow, alyoung, gklein, thildred, yeylon
Target Milestone:	---	Keywords:	FutureFeature
Target Release:	3.3.0
Hardware:	x86_64
OS:	Linux
Whiteboard:	network
Fixed In Version:		Doc Type:	Enhancement
Doc Text:		Story Points:	---
Clone Of:	976154	Environment:
Last Closed:		Type:	Bug
Regression:	---	Mount Type:	---
Documentation:	---	CRM:
Verified Versions:		Category:	---
oVirt Team:	Network	RHEL 7.3 requirements from Atomic Host:
Cloudforms Team:	---	Target Upstream Version:
Embargoed:
Bug Depends On:
Bug Blocks:	976154

Comment 2 Tim Hildred 2013-09-05 07:09:16 UTC

Updated "Creating a Bond Device using the Administration Portal" - ID: 7628 [rev: 507022]
"You can bond compatible network devices together. This type of configuration can increase available bandwidth and reliability. You can bond multiple network interfaces, pre-existing bond devices, and combinations of the two. 
A bond cannot carry both vlan tagged and non-vlan traffic."

And changed instances of "network interface" to "network device" so that bonds as well as NICs are covered.


Added:
"Bonding Logic in Red Hat Enterprise Virtualization" - ID: 22487 [rev: 507138]

Comment 5 Tim Hildred 2013-10-04 09:04:36 UTC

Thanks, fixed.