Red Hat Bugzilla – Bug 976154
[Docs][Tracker]: Improve bonding logic
Last modified: 2016-02-10 14:55:43 EST
Updated "Creating a Bond Device using the Administration Portal" - ID: 7628 [rev: 507022]
"You can bond compatible network devices together. This type of configuration can increase available bandwidth and reliability. You can bond multiple network interfaces, pre-existing bond devices, and combinations of the two.
A bond cannot carry both vlan tagged and non-vlan traffic."
And changed instances of "network interface" to "network device" so that bonds as well as NICs are covered.
"Bonding Logic in Red Hat Enterprise Virtualization" - ID: 22487 [rev: 507138]
Reassigning to Jodi Biddle (email@example.com) as I am no longer working on Red Hat Enterprise Virtualization documentation.