Bug 976154

Summary:	[Docs][Tracker]: Improve bonding logic
Product:	Red Hat Enterprise Virtualization Manager	Reporter:	Tim Hildred <thildred>
Component:	Documentation	Assignee:	Jodi Biddle <jbiddle>
Status:	CLOSED CURRENTRELEASE	QA Contact:	ecs-bugs
Severity:	medium	Docs Contact:
Priority:	unspecified
Version:	3.1.1	CC:	aburden, acathrow, alyoung, sfolkwil, zdover
Target Milestone:	---	Keywords:	FutureFeature
Target Release:	3.3.0
Hardware:	x86_64
OS:	Linux
Whiteboard:	network
Fixed In Version:		Doc Type:	Enhancement
Doc Text:		Story Points:	---
Clone Of:	825801
Clones:	978220 978221 978223 (view as bug list)		Environment:
Last Closed:	2014-04-07 03:06:07 UTC	Type:	Bug
Regression:	---	Mount Type:	---
Documentation:	---	CRM:
Verified Versions:		Category:	---
oVirt Team:	Network	RHEL 7.3 requirements from Atomic Host:
Cloudforms Team:	---	Target Upstream Version:
Embargoed:
Bug Depends On:	825801, 978220, 978221
Bug Blocks:	978223

Comment 1 Tim Hildred 2013-09-05 05:54:55 UTC

Updated "Creating a Bond Device using the Administration Portal" - ID: 7628 [rev: 507022]
"You can bond compatible network devices together. This type of configuration can increase available bandwidth and reliability. You can bond multiple network interfaces, pre-existing bond devices, and combinations of the two. 
A bond cannot carry both vlan tagged and non-vlan traffic."

And changed instances of "network interface" to "network device" so that bonds as well as NICs are covered.

Comment 2 Tim Hildred 2013-09-05 07:00:22 UTC

Added:
"Bonding Logic in Red Hat Enterprise Virtualization" - ID: 22487 [rev: 507138]

Comment 4 Tim Hildred 2013-10-28 00:03:46 UTC

Reassigning to Jodi Biddle (jbiddle) as I am no longer working on Red Hat Enterprise Virtualization documentation.