Red Hat Bugzilla – Bug 978223
[Docs] [Tech Ref]: Improve bonding logic
Last modified: 2016-02-10 14:55:26 EST
Section 4.2.4 ,"Bond" in the RHEV 3.3 Technical Reference Guide consists of a functional definition of "bond" ("[...] aggregates multiple NICs in a parallel manner into a single software device") and an explanation of the seven bonding modes.
None of the bonding modes has changed between RHEV 3.2 and RHEV 3.3.
Since the behavior of the interface is not described in the Technical Reference Guide and is not intended to be described in the Technical Reference Guide, I am CLOSING this NOTABUG.